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September 19, 2025

Tencent issued renminbi-denominated Dim Sum bonds in offshore markets to fund AI, cloud computing, and foundational model development. With 5,...
Huawei detailed its compute and chip roadmap at Shanghai Connect 2025, unveiling Ascend AI chips, Kunpeng processors, supernodes, and HBM...
Foreign investors returned to Asian bond markets in August after two months of outflows, led by inflows into India and...

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South Korea’s new K-Humanoid Alliance brings together tech giants and...
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